Samsung has just unleashed the world's first GDDR7 memory clocked at 32Gbps, ready for future waves of GPUs, AI, HPC, and automotive vehicles. We can expect a 1.4x performance boost and a 20% improvement in power efficiency with the new GDDR7 memory @ 32Gbps over the existing GDDR6 memory @ 24Gbps... totally ready for your next-gen Gaming PC.
The company announced that it has completed the development of the industry's first GDDR7 memory, ready for next-gen products for its "key customers" for verification later this year. Samsung developed the world's first GDDR6 memory @ 24Gbps back in 2022, while the new GDDR7 memory standard offers the industry's highest speed yet. Samsung has innovated in integrated circuit (IC) design and packaging that adds stability, even though we're at the lofty heights of 32Gbps of bandwidth.
Yongcheol Bae, Executive Vice President of Memory Product Planning Team at Samsung Electronics said: "Our GDDR7 DRAM will help elevate user experiences in areas that require outstanding graphics performance, such as workstations, PCs and game consoles, and is expected to expand into future applications such as AI, high-performance computing (HPC) and automotive vehicles. The next-generation graphics DRAM will be brought to market in line with industry demand and we plan on continuing our leadership in the space".
Samsung's new GDDR7 memory @ 32Gbps is capable of pumping out up to 1.5TB/sec (1500GB/sec) of bandwidth, a 1.4x increase over GDDR6 @ 1.1TB/sec (1100GB/sec). The company was able to achieve this using improvements in the Pulse Amplitude Modulation (PAM3) signaling method that is used for the new memory standard, compared to the Non Return to Zero (NRZ) from previous-gen products. PAM3 offers 50% more data to be transmitted than NRZ within the same signaling cycle.
We've also got 20% more power efficiency with GDDR7, with the power-saving design technology optimised for high-speed operations, especially in use cases where products need low power usage: like laptops, as Samsung has a low-operating voltage option with its new GDDR7 memory. Not only that, but Samsung is reducing heat generation by using epoxy molding compound (EMC) with high thermal conductivity used for the packaging material, on top of the IC architecture optimisation. Samsung says that these improvements "dramatically reduce" thermal resistance by 70% compared to GDDR6 memory, helping out in stable product performance even those high 32Gbps speeds.
